In order to better understand titanium sputtering targets, it is first important to understand titanium.
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Titanium is a metallic element that is known for its strength and durability. The relatively high melting point (more than 1,650 or 3,000 ) makes it useful as a refractory metal. Titanium sputtering targets are made from titanium metal and are used in a process called sputter coating.
The titanium targets are commonly used in hardware tool coating, decorative coating, semiconductor components, and flat display coating. There are two main methods for making titanium sputtering targets: melting and casting.
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Melting: the metal is heated to a high temperature until it becomes liquid. It is then poured into a mold and allowed to cool, resulting in a solidified target.
Casting: the metal is placed in a vacuum chamber and bombarded with high-energy particles. This causes the metal to vaporize, and as it cools, it condenses onto the surface of the target.
It is one of the core materials for preparing integrated circuits, and purity usually requires over 99.99%. AEM offers Titanium alloy targets such as Tungsten Titanium (W/Ti 90/10 wt%) Sputtering Target, an essential material for the semiconductor and solar industry. The W/Ti sputtering target density can reach over 14.24 g/cm3, and the purity can reach 99.995%.