Sputtering targets are a physical vapor deposition (PVD) mechanism with many uses in modern technology and manufacturing.
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In the sputtering process, the atoms are pulled from the sputter target with powerful magnets, and a controlled gas (usually argon) is introduced. Then, the processed to collide with each other in their gaseous state before condensing into a plasma that dries into a thin film on the substrate.
Many products commonly used today have a coating created through sputtering materials. These coatings include:
Sputter coater targets are used to produce low-radiation coated glass (Low-E glass).
Low-E glass is commonly used in building construction because of its ability to save energy, control light, and for aesthetics.
Optical coatings are largely used in the area of sunglasses, eyeglasses, vehicle headlights, mirrors, windows, optic filters for laser technology.
With demands for renewable energy on the rise, the third generation, thin-film solar cells are prepared using sputter coating technology.
The Cadmium telluride sputtering target (CIGS target) has a large share of the solar market.
Most modern-day electronics incorporate essential components which have been produced with tantalum sputtering targets.
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These include microchips, memory chips, print heads, flat panel displays as well as others.
Sputtering deposition is one of the most common processes used for thin film deposition: the coating of a surface with a layer of material ranging from fractions of a nanometer to several micrometers in thickness. Thin film deposition is essential to manufacturing of many modern electronic and optical components
Sputtering deposition uses a plasma, usually formed from a non-reactive gas, to bombard a target---a source of the material to be deposited as a thin film---and knock the atoms of the target material out of its bulk. The ejected atoms then land on the substrate and form a thin film. Since the target does not need to be heated, the technique is very flexible for a wide range of applications. Targets can be composed of pure elements as well as compounds or mixtures.
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Our standard target sizes range from 1" to 8" in diameter and from 2mm to 1/2" thick. We can also provide targets outside this range in addition to just about any size rectangular, annular, or oval-shaped target. Other shapes are available by request.
For large area thin film deposition, American Elements produces rotatable sputtering targets via casting or plasma deposition onto a tubular substrate. Rotatable sputtering targets are available up to 1,000 mm in length and can be produced from a number of single element, oxide and alloy materials for use in many applications where large film areas are required, such as photovoltaic device fabrication. All machined pieces are produced by casting oversized blanks, and machining down to required specifications. They are usually machined to tolerances of +0.010"/-0" on diameter, length or width, and +/-0.005" on thickness. Larger targets are also finished to a flatness within 0.015". We can accommodate tighter tolerances upon request.
American Elements casts any of the rare earth metals and most other advanced material into rod, bar or plate form, as well as other machined shapes. All as-cast rods, bars and plates are produced from either the pure metal Ingots or sublimed metals. We have a variety of standard sized rod molds, from a minimum of 1/4" diameter up to 3" diameter for most rod needs. Plates are also offered in standard thicknesses, from 1/4" thick to 1" thick. Maximum rod lengths and maximum plate sizes are dependent on melt capacity and furnace room. Small diameter rods may have only a 4"-6" maximum cast length, whereas larger diameter rods may be cast up to about 16" long. Plate sizes can be cast up to a size of 24" x 16". As-cast rods or plates are saw-cut to length or final dimensions, and the metal surface may have visible flow marks.
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