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Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz

Purity: 99.995%, Size: 2'' , Thickness: 0.250'' 

Sputtering is a proven technology capable of depositing thin films from a wide variety of materials on to diverse substrate shapes and sizes.
The process with sputter targets is repeatable and can be scaled up from small research and development projects. The proses with sputter
targets can be adapted to the production batches involving medium to large substrate areas. The chemical reaction can occur on the target
surface, in-flight or on the substrate depending on the process parameters. The many parameters make sputter deposition a complex process 
but allow experts a large degree of control over the growth and microstructure of the area. 

Applications of Sputtering Targets;

• Sputtering targets is used for film deposition. The deposition made by sputter targets is a method of depositing thin films by sputtering
        that involves eroding material from a "target" source onto a "substrate" such as  a silicon wafer.
• Semiconductor sputtering targets is used to etch the target. Sputter etching is chosen in cases where a high degree of etching anisotropy
        is needed and selectivity is not a concern.
• Sputter targets is also used for analysis by etching away the target material.

One of the example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered, 
the concentration and identity of sputtered atoms are measured using mass spectrometry. By helping of the sputtering target, the composition of the
target material can be determined and even extremely low concentrations of impurities are detected.

Sputtering target has also application area in space. Sputtering is one of the forms of space weathering, a process that changes the physical and 
chemical properties of airless bodies, such as asteroids and the Moon.

Silicon Dioxide (SiO2) Sputtering Target

To add a Cu Backing Plate with Indium Bonding for Sputtering Targets 

 

Form:

Fused Silica, Amorphous

CAS#:

7631-86-9

Molar Mass:

60.08 g/mol (anhydrous)

Density:

2.2 g/cm3

Melting Point:

1,713 °C

Shape:

Discs, Rectangle, Step, Plates, Sheets, Rods, Custom-Made

Dimension:

Diameter (200mm), Length (300mm), Width (200mm), Thickness (1mm), Custom-Made

MSE Supplies is a premier supplier of quality manufactured sputtering targets; we supply custom chemical compositions, purity and sizes. Our wide variety of targets are grouped by high purity metals, alloys, ceramics, and doped. Our pricing is competitive and we consistently offer price matching for our customers.

Typical Analysis

Physical Properties

With competitive price and timely delivery, Acetron sincerely hope to be your supplier and partner.

Parameter

Specifications

Size

Various

Purity

99.99%

Chemical Analysis via ICP-AES

Element

Value (ppm)

Nb

10

Fe

23

Al

15

Mg

6

Na

6

K

12

Ca

13

 

Want more information on sio2 sputtering? Feel free to contact us.