Sputtering Targets

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What Is Sputtering?

Sputtering is a technology used to form a thin film on a silicon wafer, glass, or other substrate. Within a vacuum state maintained in a sputtering machine, a sputtering target is bombarded with argon ions. This causes atoms or molecules to be emitted from the sputtering target. The atoms or molecules are deposited and form a thin film on the substrate. A sputtering target is the object of the ion bombardment when sputtering takes place.

See the sputtering process explained in a video:

https://www.youtube-nocookie.com/watch?v=3DuGuJacvmc

From standard, single element materials to custom compounds, small circular to multi-tile and stepped constructions, commercial grade to ultra-high purities, Angstrom Sciences provides the highest quality magnetron sputtering target materials.

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We utilize a variety of specialized processing techniques such as hot pressing, hot isostatic pressing (HIP), cold isostatic pressing (CIP), induction vacuum melting, and vacuum casting to produce homogenous, fine-grained, high-density materials that conform to the strictest application standards.

All sputtering targets are cleaned, inspected, chemically-tested, and packed under inert gas for immediate use in your vacuum system.

Angstrom Sciences provides a full range of sputtering target materials including: precious metals, pure metals, alloys, ceramics, cermets, borides, oxides, carbides, nitrides, silicides, and fluorides.

Purities range from commercial grade (99.5%) to ultra high (99.9999%).

Pricing and delivery times are subject to change without notice.

For more information about Sputtering Targets, call 412-469-8466 or contact us online.

The company is the world’s best metal sputtering target supplier. We are your one-stop shop for all needs. Our staff are highly-specialized and will help you find the product you need.