There are many reasons that sputtering targets fail. Some are material specific, while others can be avoided or prolonged by reviewing a few things before sputtering begins.
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The amount of power that can be applied varies by material. Visit www.lesker.com sputtering target pages for recommendations on most common materials.
Some materials require a slow ramp up in power. Applying too much power quickly can cause many materials, especially ceramics and low melting point materials, to fail before deposition can even begin. See our website for a ramping procedure that can be used in these cases.
Many materials perform better with bonding. Bonding the target to a backing plate allows for better cooling, adds stability to thin targets, and allows sputtering to continue after minor cracking occurs. Bonding a target will limit the amount of power that can be applied to ~20 watts/square inch. For specifics on which materials are recommended to be bonded, please visit www.lesker.com sputtering target pages prior to ordering.
To meet the growing demands of today's devices for lower power use and faster processing, the semiconductors making such performance gains possible require various kinds of high-quality targets.
We deliver sputtering targets for semiconductors - products for which high purity is a key requirement - by means of highly stable processes extending from mass production products to specially developed products.
What's more, our well-equipped manufacturing and service sites in Japan and throughout the world enable timely technical, sales, and delivery support.
Are you interested in learning more about planar sputtering targets? Contact us today to secure an expert consultation!